MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs, according to industry sources.
MediaTek is now a firm leader in the handset application processor (AP) market, and will continue to increase its market shares for flagship and mmWave mobile SoCs. In terms of other terminal products, the company will compete head-to-head with many peers in the US and Europe in the field of wireless communication chips, and will also tap deeper into the PMIC market. All this will enable the company to realize a multi-faceted growth model independent of its outstanding growth in the handset SoC market, the sources said.
MediaTek now boasts strong R&D and integration capabilities for multiple chip technologies, such as high-performance and low-power-consumption CPU, GPU, and APU (accelerated processing unit) chips, as well as 5G, Wi-Fi 6/6E/7, Bluetooth, and 10G PON (passive optical network) chip solutions. All of these, together with outstanding edge AI technology and diverse PMIC solutions, constitute a powerful arsenal with which the company can power its growth over the next few years, the sources continued.
At a recent investor conference, MediaTek CEO Rick Tsai stressed that technology upgrades and market share expansions will dominate the company's growth pattern over the next three years.
Tsai said the handset market is becoming mature and will sustain a shipment growth of over 20% in 2022, but smart terminal applications are bound to see higher growth momentum than handsets.
Tsai also noted that wireless networking chips will become MediaTek's most powerful weapon for its future business expansions. He stressed that MediaTek is fast catching up with market leaders in terms of shipments of Wi-Fi 6/6E core chips, and has even outpaced major peers in rolling out Wi-Fi 7 solutions for clients' validation.
Tsai disclosed that MediaTek is also preparing for new technology development trends for the next three years, and will continue its investment in developing high-tech technologies, including HPC chips, 5G modem chips, Wi-Fi 7 core chips, GPUs, and security IP.
The company will also deepen its cooperation with foundry partners in advanced process nodes and 3D chipset technology, according to Tsai.
Article translated by Willis Ke
