中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
HBM
Nvidia
AI Search
NTN Convergence
Robotics Report
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Weekly news roundup: semiconductor power shifts and AI momentum
Semiconductors
20min ago
Home
Research
Research insights
Sony sets up mobility company; China to scrap new energy vehicle subsidies by end-2022; Diodes steps into SiC power modules
Tom Lo, DIGITIMES Research, Taipei
Jan 11, 2022, 17:54
0
The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please
sign in
if you wish to continue.
Introduction
Related story
Sony and Honda sign MoU for strategic alliance in mobility field
Tags
Asia enterprises
Sony
vehicle
Share this article
Other links
Print
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
7 DAYS NEWS
Pentagon withdraws 1260H list adding Alibaba, BYD and Baidu, removing YMTC and CXMT
CXMT, YMTC scale up DRAM and HBM output keenly in largest expansion push yet
TSMC revises five-year growth plan, turning tech lead into high profits
Apple reportedly agrees to double NAND prices from Kioxia, shifts to quarterly contract pricing
China's memory makers abandon low-price strategy: DRAM, NAND near Korean levels
India roundup: An emerging chip trio in Asia
Nvidia's Vera Rubin platform faces HBM4, cooling, and software hurdles ahead of ramp
Google brings Intrinsic in-house to accelerate physical AI development
TSMC bolsters local equipment supply chain with subsidies and five-year rebate program
Insight: Memory shortage tightens grip on smartphone market as prices near tipping point
Full list
Join our mailing list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first