Power and compound fab capacity to top 10 million wafers monthly in 2023, says SEMI

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Power and compound fab capacity to top 10 million wafers monthly in 2023, says SEMI

Jessie Shen, DIGITIMES, Taipei Thursday 14 October 2021 0

Credit: STMicro

Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in...

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Categories

Chips + components IC design, distribution IC manufacturing Passive, PCB, other IC components

Tags

200mm 2020 automotive capacity China demand electronics Europe fab Infineon Japan R&D SEMI semiconductor STMicroelectronics supply chain Taiwan worldwide

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