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    Home Tech Chips + Components

    IDMs step up deployments in GaN, SiC devices

    Julian Ho, Taipei; Willis Ke, DIGITIMES 0

    Credit: DIGITIMES

    IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor materials, according to industry sources.

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    Categories
    Chips + components IC design, distribution IC manufacturing Passive, PCB, other IC components
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    automotive Delta Electronics Digitimes Research electronics GaN Infineon infrastructure manufacturing materials outsourcing power supply Rohm semiconductor STMicroelectronics TI transportation TSMC UMC VIS
    Companies
    Delta Electronics Taiwan Semiconductor Manufacturing Company United Microelectronics Corporation Vanguard International Semiconductor
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