IDMs step up deployments in GaN, SiC devices

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Home Tech Chips + Components

IDMs step up deployments in GaN, SiC devices

Julian Ho, Taipei; Willis Ke, DIGITIMES Friday 24 September 2021 0

Credit: DIGITIMES

IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor materials, according to industry sources.

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Categories

Chips + components IC design, distribution IC manufacturing Passive, PCB, other IC components

Tags

automotive Delta Electronics Digitimes Research electronics GaN Infineon infrastructure manufacturing materials outsourcing power supply Rohm semiconductor STMicroelectronics TI transportation TSMC UMC VIS

Companies

Delta Electronics Taiwan Semiconductor Manufacturing Company United Microelectronics Corporation Vanguard International Semiconductor

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