中文網
Taipei
Mon, May 23, 2022
00:16
cloudy
23°C
CONNECT WITH US

Applied Materials breakthrough in chip wiring enables logic scaling to 3nm and beyond

Jessie Shen, DIGITIMES, Taipei 0

Applied Materials has unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories