Global wafer foundry industry analysis and forecast, 2022

Apple reportedly to sharply cut VCSEL die size for 3D sensors

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Friday 14 May 2021 0

Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move that will help the vendor sharply cut production cost but may reduce...

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