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Highlights of the day: TSMC expanding 5nm capacity

DIGITIMES staff

TSMC is fast expanding capacity for 5nm process to meet strong demand from a host of heavyweight clients, including Apple, AMD and MediaTek. The foundry house's capacity for 5nm process is expected hike by one third in second-half 2021 compared to that in the last quarter of 2020. MediaTek has also obtained more capacity support from TSMC for chip production at 6nm and 7nm to facilitate its 5G chip shipments. Meanwhile, ODM Wistron and Taiwan's Chunghwa Telecom have teamed up eyeing the 5G and AI services sectors.

TSMC 5nm process capacity to top 120,000 wafers monthly in 2H21: TSMC is poised to scale up its 5nm process manufacturing capacity to 105,000 wafers monthly in the first half of 2021, up from 90,000 units in fourth-quarter 2020, with plans to further expand the process capacity to 120,000 units in the second half of this year, according to industry sources.

MediaTek wins more TSMC support to boost 5G chip shipments: MediaTek has obtained sufficient 6nm and 7nm process capacity at TSMC, which will allow the mobile SoC specialist to boost its 5G chip shipments in 2021, according to industry sources.

Wistron, Chunghwa Telecom team up to tap 5G, AI service sectors: Wistron Group has forged a strategic alliance with Chunghwa Telecom (CHT) to jointly tap business opportunities arising from proliferating 5G and AI applications.