Subscribe to newsletter

REALTIME NEWS

Phison, Silicon Motion see both challenges and possibilities

Before Going to Press

Holtek, Nuvoton to deepen global deployments

Before Going to Press

Aluminum capacitor makers put growing focus on automotive

Before Going to Press

LemTech to build new plant for EV solutions in Mexico

Before Going to Press

IC backend firms urged to expand production capacity in Southeast Asia

Before Going to Press

China remains committed to chip self-sufficiency

Before Going to Press

PCB and IC substrate makers upbeat about demand for AI servers

Before Going to Press

AI seen as future driver of IC market growth

Before Going to Press

Cvilux expects notebook demand to rebound in May-June

Before Going to Press

Asustek, HTC struggling to make their handset businesses profitable

Before Going to Press

TSEC to build additional solar cell and module capacity

Before Going to Press

ASEH steps up deployment in automotive electronics sector

Before Going to Press

Home Tech Semiconductors

COF, COG packaging materials shipments ramping up

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Tuesday 13 October 2020 0

Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third quarter of the year, driven by strong demand for display driver ICs for...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.

LOGIN

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.
Asia Supply Chain 100 dataset access.
Access to research insights.

Categories

Chips + components IC design, distribution IC manufacturing

Tags

5G Chipbond ChipMOS COF COG demand display driver IC handset materials OLED packaging shipments TDDI

Companies

Chipbond Technology ChipMOS Technologies

Related stories

6 new categories! Expand your business with authentic data.

ThroughTek to unveil latest cloud VMS at ISC West 2023

Global server shipment forecast and industry analysis, 2022

Automotive chip supply turns stable in 2023; Tesla SiC cut unlikely to hurt the market, says DIGITIMES Research

TOP STORIES
MOST-READ 2022