TSMC is fast advancing its manufacturing processes, and it has already disclosed a plan to build a 2nm fab in Hsinchu, northern Taiwan. And if demand is strong, it may have to expand a central Taiwan fab to house more 2nm capacity, according to the foundry house's chairman. TSMC is also fast expanding its IC packaging capacity, with plans to opne two new packaging fabs in the next two years. The semiconductor is embracing opportunities in the era of 5G and AI, which Micron believes will drive memory market growth in the next decade.
TSMC may expand factory site in central Taiwan for 2nm process: TSMC may expand its factory site in Taichung, central Taiwan for additional 2nm process capacity, according to company chairman Mark Liu.
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform: TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly unveiled 3D Fabric wafer level system integration technology platform, according to industry sources.
AI and 5G to drive memory market growth over next decade, says Micron: The emerging artificial intelligence (AI) and 5G technologies are set to generate unprecedented opportunities and productivity, which will be driving the memory market growth over the next 10 years, according to Micron Technology EVP of global operations Manish Bhatia.