中文網
Taipei
Sat, Aug 13, 2022
07:21
clear
27°C
CONNECT WITH US

Semiconductor packaging materials to see 3.4% CAGR during 2019-2024

Jessie Shen, DIGITIMES, Taipei 0

The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR), according to a joint forecast made by SEMI and TechSearch Internatio...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories