Bits + chips
Chipbond to strengthen non-driver IC backend services
Julian Ho, Taipei; Willis Ke, DIGITIMES

Display driver IC backend specialist Chipbond Technology is constructing a new plant designed mainly for processing RF and PA components for use in 5G devices, which will significantly strengthen its non-driver backend capacity, according to company...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.