Supply chain
Highlights of the day: TSMC keen on packaging technology

TSMC is unqestionably the global leader in the pure-play foundry, but it is also gearing up efforts expanding its presence in the backend sector. Its advanced wafer-level packaging capacity is set to enjoy rising utilization in second-quarter 2020. TSMC has not been much affected by the coronavirus outbreak, unlikely many other manufacturers in the IT and semiconductor sectors. But Foxconn has disclosed that it expects to resume normal production in China by the end of March. The outbreak may be hitting hard the hadnset market, but Samsung and Huwaei have been keen to roll out their foldable devices featuring flexible AMOLED screens. Rising popularity for flexible AMOLED is expected to benefit BOE Technology, a major supplier of such displays.

TSMC advanced packaging capacity utilization to climb: Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second quarter of 2020, according to sources at dedicated OSAT companies.

Foxconn to resume normal production in China by end of March: Foxconn Technology, the world's largest EMS provider, expects to resume normal production in China - where the majority of its manufacturing facilities are located - by the end of March, and forecasts its revenues for the first half of 2020 to stay flat as compared with a year earlier, according to company chairman Young Liu.

BOE making headway in flexible AMOLED: BOE Technology is expected to continue to enhance its presence in the flexible AMOLED panel sector as handset brands including Samsung Electronics and Huawei remain committed to rolling foldable smartphones this year despite the impacts of the coronavirus outbreak, according to industry sources.

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