Bits + chips
Samsung develops 12-layer 3D-TSV
Jessie Shen, DIGITIMES, Taipei

Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.