Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.
Hinge makers to ramp up shipments for foldable smartphones in 2H20
10h 19min ago in Before Going to Press
Wistron to expand output at production site in India
10h 26min ago in Before Going to Press
Nuvoton joins AWS partner network
10h 31min ago in Before Going to Press
Taiwan IC backend houses to expand production capacity
10h 34min ago in Before Going to Press
Pegatron to set up plant in Vietnam
10h 56min ago in Before Going to Press
New Apple iPad reportedly to feature scissor switch keyboard
10h 57min ago in Before Going to Press
HDI PCB makers poised for strong 1Q20
Mini LEDs and micro LEDs are expected to become improved backlighting solutions that can significantly enhance displays quality and create added value in the upcoming years.
Digitimes Research estimates that global server shipments moderately declined 1.4% in 2019 but will turn to show positive growth of 6.6% in 2020, totaling 16.01 million units.
Worldwide shipments of smartphone application processors are expected to fall.