PSI files wafer thinning patent infringement lawsuit against iST

Taipei, Sunday, June 7, 2020 18:20 (GMT+8),

29°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Asian Edge: On the Frontline of the ICT World

Bits + chips

PSI files wafer thinning patent infringement lawsuit against iST

Monica Chen, Taipei; Willis Ke, DIGITIMES

Wednesday 18 September 2019

Wafer reclaim and thinning specialist Phoenix Silicon International (PSI) has filed a lawsuit with the Taiwan IP court against Integrated Service Technology (iST) accusing it of infringing its patent concerning wafer thinning process technology.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Coronavirus impact special report: Mobile devices
The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.
Global server shipment forecast and industry analysis, 2020
Digitimes Research estimates that global server shipments moderately declined 1.4% in 2019 but will turn to show positive growth of 6.6% in 2020, totaling 16.01 million units.
Global AP demand forecast, 2017-2022
Worldwide shipments of smartphone application processors are expected to fall.

Digitimes Research Quarterly Data services

© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only