CONNECT WITH US

Samsung developing FOPLP for wearable devices

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia 0

Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application processors (AP) for use in wearable devices since 2018, according to...

The article requires paid subscription. Subscribe Now