Bits + chips
Phison poised to embrace 96-layer 3D NAND tech by end of 2018
Josephine Lien, Taipei; Willis Ke, DIGITIMES

With the global NAND flash industry successfully transitioning to the 64/72-layer 3D specification era in 2017, Taiwan-based Phison Electronics is prepared to advance further to the 96-layer technology by the end of 2018, according to company chairman...

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