Globalfoundries demos 2.5D HBM solution

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Globalfoundries demos 2.5D HBM solution

Jessie Shen, DIGITIMES, Taipei

Wednesday 16 August 2017

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

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