Qualcomm, ASE, Brazil government sign MOU to build IC testing/packaging plant in Brazil, says paper

Commercial Times, March 23; Steve Shen, DIGITIMES Asia 0

Advanced Semiconductor Engineering (ASE), Qualcomm and the Brazil government reportedly have signed a MOU to jointly invest US$200 million initially to establish an IC testing/packaging plant in Sao Paulo, according to Chinese-language Commercial...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.