Supply chain
NANIUM enables WLCSP without UBM
Press release

NANIUM S.A., a leading provider of advanced semiconductor packaging known for its innovative solutions, today announced it achieved outstanding reliability results for a Wafer-Level Chip Scale Package (WLCSP) without the typically applied Under Bump Metallization (UBM). The product, with a package of 5.8 x 5.4 mm2, endured over 1,000 TCoB, a reliability milestone for a UBM-less WLCSP package that reflects the company's know-how in both WLCSP and Wafer-Level Fan-Out (WLFO) technologies.

"This is a remarkable achievement that reflects the intense development work we have been carrying out at NANIUM", explained Vitor Chatinho, NANIUM's senior integration engineer responsible for the project. "The reliability results we achieved without UBM translate into a shorter manufacturing cycle time of the products, as well as a clear cost advantage. This is an outbreak that positions WLCSP technology as one the most cost-efficient in the market without reliability compromise."

NANIUM was among the first in the world to offer WLFO in high volume manufacturing and, indeed, the company's expertise in WLFO process were key to the development of this solution. This new qualified solution required a thorough knowledge and fine-tuning of WLCSP material characteristics and package design, something that the company had already attained upon their work for qualifying the world's largest WLCSP package in 2014.

The new WLCSP packages, developed for a product in the mobile market, are an optimal configured combination of material, process and design elements. They have exceeded 1,000 cycles in the temperature cycling on board test (TCoB @ -40 to 125 degrees C), performed according to IPC-9701 (condition TC3) standard, while also exceeding 200 drops in the Board Level Drop Test performed according to the JEDEC JESD22-B111 standard. These results were considered excellent, as UBM generally is an essential element in the package construction of WLCSP to achieve these reliability levels.

WLCSP is a Fan-In technology that offers the highest electrical/thermal performance, as well as the smallest package form-factor possible in the semiconductor packaging industry. It enables low-cost manufacturing for product applications such as Mobile and Consumer products, Wireless connectivity, MEMS and Sensors.

NANIUM will be showcasing this WLCSP solution at Semicon West, along with its other wafer-level packaging technology innovations. The event will be held in San Francisco, California, USA, from July 14th to July 16th, 2015.

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