TSMC to offer InFO-WLP technology for 16nm chips, eyeing Apple orders
Josephine Lien, Taipei; Jessie Shen, DIGITIMES
Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's A10 processors, according to industry sources.
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.