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TSMC seeks large stake in German fab

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TPK puts development focus on automotive LiDAR

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Edge AI market to boom, say IC design houses

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Short lead-time orders for AI and automotive chips emerge, says Formosa Sumco

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Rise in AI chip orders boosts WinWay revenue in May

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Inventory correction for passive components persists, says Yageo

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TSMC and its ecosystem partners jointly build UltraFusion

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MR related peripheral IC demand promising

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Radiant supplies backlight modules for new Macbook Air

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Supply chain cautious about demand for new MacBook Air

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TacBright sees brisk order visibility

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Home Tech Semiconductors

Shipments of USB 3.1 peripherals and chips to take off in 1H15

Cage Chao, Taipei; Steve Shen, DIGITIMES Asia Wednesday 24 December 2014 0

Shipments of PC peripherals and chips supporting USB 3.1 standards are set to take off in the first half of 2015 due to the support of USB 3.1 interfaces by Microsoft, Intel, Apple and other PC suppliers, according to industry sources.

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