Winbond Electronics has signed a five-year NT$9 billion (US$300.71 million) syndicated loan agreement with a banking consortium led by Chinatrust Commercial Bank, according to the company.
The newly raised funds will be used to finance technology and equipment upgrades, capacity ramp as well as to enhance its working capital, said the chipmaker.
Winbond will raise its capex for 2014 to NT$10.6 billion and will expand its 12-inch wafer production capacity to 40,000 units a month from 35,000 units, according to a Chinese-language Economic Daily News (EDN) report.
Meanwhile, Winbond and its subsidiary Nuvoton Technology combined posted consolidated revenues of NT$3.31 billion for June, up 1.7% sequentially and 16.5% on year. Accumulated revenues through June 2014 amounted to NT$18.49 billion, increasing 11.9% from a year earlier.
