TSMC reportedly to tie up with Micron to develop 3D ICs

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TSMC reportedly to tie up with Micron to develop 3D ICs

Josephine Lien, Taipei; Steve Shen, DIGITIMES

Tuesday 3 June 2014

Taiwan Semiconductor Manufacturing Company (TSMC) reportedly plans to team up with Micron Technology to develop 3D ICs that will integrate Micron's hybrid memory cube-based DRAM chips with TSMC's logic chips through TSV technology, according to industry...

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