Global wafer foundry industry analysis and forecast, 2022

TSMC to ramp IC packaging revenues to US$1 billion in 2015, says paper

EDN, April 21; Steve Shen, DIGITIMES Asia Monday 21 April 2014 0

Taiwan Semiconductor Manufacturing Company (TSMC) aims to ramp up its IC packaging revenues to US$1 billion in 2015 and to US$2 billion in 2016, according to a Chinese-language Economic Daily News (EDN) report.

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