We have recently changed our search engine. Check the Advanced options to learn the new search rules.
Bits + chips
CES 2013: More new multi-core chipset solutions unveiled, heating up competition
Daniel Shen, Las Vegas; Steve Shen, DIGITIMES
Chipset vendors including Nvidia, Qualcomm, Samsung Electronics and ST-Ericsson have all unveiled their new multi-core solutions for mobile devices and other applications at CES 2013, heating up competition in the segment in the year, according to industry...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.