Huawei Technologies will revamp its policy on the adoption of chipset solutions for smartphones and will enhance cooperation with its chipset subsidiary HiSilicon Technologies for the development of high-end smartphones, according to Frederic Fleurance, global marketing director for handsets at Huawei.
Huawei aims to reduce the number of platforms in the development of smartphones, with plans to discontinue the adoption of Texas Instruments (IT) OMAP platform after the release of the dual-core Ascend P1, Fleurance revealed. Huawei currently adopts five platforms for smartphones.
Huawei has cooperated with MediaTek to launch two smartphones in China and will continue to cooperate with MediaTek in the future, said Fleurance, adding that Qualcomm will remain the largest supplier of chipset solutions for Huawei.
Huawei will launch its first quad-core smartphone, the Ascend D1 Quad, in the fourth quarter of 2012, utilizing HiSilicon's quad-core K3V2 CPUs, Fleurance indicated.
Huawei also plans to roll out at least four smartphone models built on HiSilicon's platform in 2013, including LTE-enabled models which support LTE Category 4 with data rates of 150Mbps, revealed Fleurance.
Huawei's first quad-core tablet PC, the MediaPad 10 FHD, will also adopt a HiSilicon 1.5GHz quad-core CPU, and come with a 10-inch IPS display for a thickness of only 8.8mm. Huawei plans to introduce the model, which runs on Android 4.0.3, into Taiwan in the fourth quarter.
Huawei's first quad-core smartphone, the Ascend D1 Quad
Photo: Daniel Shen, Digitimes, July 2012
Article translated by Steve Shen
