Vendors to adopt LTE/3G seamless connectivity chips for dual-mode smartphones

Daniel Shen, Taipei; Adam Hwang, DIGITIMES Asia 0

Chip design houses including Qualcomm have adopted CSFB (circuit-switch fallback) and SRVCC (single radio voice call continuity) technologies to develop single chips which enable automatic switching between LTE and 3G for voice and data communications,...

The article requires paid subscription. Subscribe Now