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New KLA-Tencor e-beam tool to accelerate defect sourcing for 20nm nodes and below

Press release; Jessie Shen, DIGITIMES Asia Tuesday 16 August 2011 0

KLA-Tencor has announced a new tool for chip manufacturing at the 20nm device nodes and below: the eDR-7000 electron-beam (e-beam) wafer defect review system.

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