Bits + chips
Second-tier IC packagers lower quotes to woo orders from IC designers
Ingrid Lee, Taipei; Steve Shen, DIGITIMES

Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching to copper wirebonding process for their chips, according to industry...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.