Nanya PCB to get more FC substrate backend orders from Intel on better yields
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to industry sources. The sources expect NPC to secure 25-30% of Intel's total...
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