Winbond takes delivery of immersion scanner for 40nm-class chips, says paper

EDN; Jessie Shen, DIGITIMES Asia Thursday 14 October 2010 0

Winbond Electronics recently took delivery of its first immersion lithography scanner, which is designed for 12-inch wafers at the 40nm-class node and beyond, according to a Chinese-language Economic Daily News (EDN) report.

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