CONNECT WITH US

Winbond to develop in-house 46nm Buried Wordline process

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia 0

Winbond Electronics has quietly recruited part of former Qimonda's R&D team and will develop a 46nm Buried Wordline stack process, making it the first Taiwan-based DRAM maker to develop 40nm node processes in-house, according to industry sources.

The article requires paid subscription. Subscribe Now