IC substrate maker Kinsus sees order visibility through May

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia 0

Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP) substrates, according to the company. Market watchers estimate Kinsus'...

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