Bits + chips
Chipbond capex to more than double in 2010
Ingrid Lee, Hsinchu; Jessie Shen, DIGITIMES

Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain Wu. Wu said Chipbond's revenues and profits will grow substantially...

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