TSMC promoting OIP by combining EDA, IP

Taipei, Saturday, June 6, 2020 19:55 (GMT+8),

30°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Asian Edge: On the Frontline of the ICT World

Bits + chips

TSMC promoting OIP by combining EDA, IP

Claire Sung, Taipei; Jessie Shen, DIGITIMES

Tuesday 4 August 2009

Taiwan Semiconductor Manufacturing Company (TSMC) is making efforts to make its OIP (Open Innovation Platform) - a technology platform for integrated services from IC design to manufacturing to packaging and testing - more attractive through combining...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Coronavirus impact special report: Mobile devices
The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.
Global server shipment forecast and industry analysis, 2020
Digitimes Research estimates that global server shipments moderately declined 1.4% in 2019 but will turn to show positive growth of 6.6% in 2020, totaling 16.01 million units.
Global mobile device shipment forecasts, 2019 and beyond: Smartphones, notebooks and tablets
Notebooks, smartphones and tablets are expected to see mixed shipment performances in 2019.

Digitimes Research Quarterly Data services

© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only