ASE and SPIL implementing capex plans for 2009

Ingrid Lee, Taichung; Jessie Shen, DIGITIMES Asia Thursday 11 June 2009 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have started implementing their capex plans for 2009, with each placing orders for 200 wire bonders in the May-June period, according to sources at the companies.

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