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STMicroelectronics, STATS ChipPAC and Infineon to set new milestone in establishing wafer-level packaging standards

Press release, August 7; Esther Lam, DIGITIMES Asia Friday 8 August 2008 0

STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB) technology, based on Infineon's first-generation technology, for...

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