Bits + chips
New handsets to support four-layer HDI boards
Ingrid Lee, Taipei; Esther Lam, DIGITIMES

As handsets are now supporting more advanced functions, compact designs are prompting a trend towards more layers in their corresponding high-density interconnect (HDI) boards. Two upcoming high-end handsets are said to be made from 4+n+4 stack-in structure,...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.