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Data storage demand continues rising in 2023, says head of Pure Storage Taiwan

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Synergy expects battery cell demand to resume in 2H23

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TSMC announces second-phase construction plan in Arizona

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Automotive chip IDMs to see difficulties pass extra costs fully to automakers

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Automotive chip supply likely to stay short before 2024

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Equipment maker Tongtai expects strong 2023

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Intel sees lack of standardized methods biggest challenge in reducing carbon footprint

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EOI forms collaboration with Cree for ADB headlamps

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Luxnet expects clients to skip 800G products

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Taiwan government to have team for protecting TSMC technologies in US

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Notebook brands to have fewer new models in next two years

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Home Tech

VIA merges chipset division under CPU, says paper

Apple Daily, January 3; Joseph Tsai, DIGITIMES Asia Thursday 3 January 2008 1

VIA Technologies merged its PC chipset division under that of CPUs in the fourth quarter of last year. Going forward the division will mainly focus on supporting the company's own-brand CPU platforms and will slowly phase out of the third-party chipset...

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IT + CE IT components, peripherals

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Mobo, chipset Mobos

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