Chipbond to receive packaging and testing orders from iPhone driver IC supplier in 4Q

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES Asia 0

Packaging and testing house Chipbond Technology will receive orders in the fourth quarter from a driver IC designer who supplies solutions for iPhones, according to Chipbond chairman FJ Wu.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.