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Chipbond budgets quarter of capex for wafer bump expansion

Commercial Times, July 13; Esther Lam, DIGITIMES Asia Friday 13 July 2007 0

Out of its budgeted NT$2.25 billion (US$30 million) capital expenditure (capex) for 2007, Chipbond Technology said its 12-inch wafer bumping expansion may account for about a quarter of the amount, according to the company as cited by a Chinese-language...

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