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MJC Probe reportedly to start silicon wafer saw in 2Q 2007

Commercial Times, December 4; Esther Lam, DIGITIMES Asia Monday 4 December 2006 0

After introducing technology on polysilicon wafer from Japan-base Ishii Hyoki, MJC Probe will start volume silicon wafer slicing in the second quarter of 2007 and the company aims to reach a full utilization rate of a million wafers per month in the...

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