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Despite slow down in ABF FC substrate expansion, Kinsus reiterates healthy market outlook

Nuying Huang and Esther Lam, DigiTimes.com Tuesday 20 June 2006 0

Despite slowing down expansion of ABF (ajinomoto build-up film) flip chip (FC) substrate production, IC substrate maker Kinsus Interconnect Technology noted that communication applications and high-end handsets boosted the average selling price (ASP)...

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