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REALTIME NEWS

TSMC seeks large stake in German fab

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TPK puts development focus on automotive LiDAR

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Edge AI market to boom, say IC design houses

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Short lead-time orders for AI and automotive chips emerge, says Formosa Sumco

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Rise in AI chip orders boosts WinWay revenue in May

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Inventory correction for passive components persists, says Yageo

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TSMC and its ecosystem partners jointly build UltraFusion

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MR related peripheral IC demand promising

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Radiant supplies backlight modules for new Macbook Air

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Supply chain cautious about demand for new MacBook Air

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TacBright sees brisk order visibility

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Home Tech Communication

BenQ and HTC speed up HSDPA phone launch

Daniel Shen, Taipei; Steve Shen, DIGITIMES Asia Tuesday 2 May 2006 0

Taiwan-based BenQ and High Tech Computer (HTC) are speeding up the respective launch of their HSDPA (high speed downlink packet access) phones, with BenQ expected to deliver its first HSDPA phone, the EF91, to T-Mobile in July and HTC to begin shipping...

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