PTI receives BGA packaging validation from Toshiba

Home Tech Chips + Components

Amy Lee, Taipei; Jessie Shen, DIGITIMES Wednesday 25 January 2006 0

Powertech Technology Inc (PTI) has gained validation from Toshiba for handset-use flash ball grid array (BGA) packaging, with volume shipments slated for February, according to the memory testing and packaging firm during the grand opening of its third...

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