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TSMC preps immersion lithography for sub-22nm wafer production

Kathryn Chiu, Hsinchu; Esther Lam, DIGITIMES Monday 16 January 2006 0

Having already commenced pilot runs on 65nm wafer production since last year, Taiwan Semiconductor Manufacturing Company (TSMC) is now readying immersion lithography for 22nm production, according to Burn Lin, director of lithography R&D at TSMC.

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