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Commentary: Hynix provides Taiwan packaging houses with about 100 million reasons to invest in China
Amy Lee, Hsinchu; Esther Lam, DIGITIMES 0

Although a jointly-established memory production plant between Hynix Semiconductor and STMicroelectronics may require monthly testing and packaging of 94 million thin small outline package (TSOP) made DRAM chips by the fourth quarter of 2006, Taiwan...

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