CSDLAB (Compound Semiconductor Device Laboratory) is an academic research center located at the NCTU, Hsinchu, Taiwan. The Lab is equipped with a wide variety of tools for compound semiconductor device processing, including: Aligner, PR coater, E-beam lithography system, ICP, RIE, PECVD, Spray etcher, Sputterer, E-gun evaporator, Curve tracer, and more.
The comprehensive device integration line at the CSDLAB is capable of processing GaAs, InP, GaN epi-wafers at up to three inches in size. (Larger epi-wafers at up to a maximum size of six inches are also available for some specific processes.)
The construction and running of the Lab is supported by the Program for Promoting University Academic Excellence, undertaking Advanced Technologies for Telecommunications (A), Development of a 60GHz GaAs MMIC Transceiver using flip-chip-based system-in-package (SIP) technology, the NFC (Nano-Facility Center) and NDL (National Nano-Device Laboratories).
CSDLAB has the following capabilities:
It can design new epitaxial structures: GaAs on Si, InGaP PHEMT, MHEMT
It is capable of developing novel and advanced device fabrication processes. These include copper-metallization processes and gate-shrinkage technologies (<0.1 micron).
CSDLAN can manufacture the following devices: GaN HEMT, GaAs PHEMT, MHEMT, GaAs or InP HBT for power or low-noise applications.
Based on the infrastructure and technologies it has established, the CSDLAB can independently design and fabricate high-frequency devices for applications of up to 100 GHz, in Taiwan. This builds a foundation for the future development of ultra-high-frequency devices for next-generation communication systems.
High-frequency GaN HEMT, GaAs PHEMT, MHEMT, GaAs or InP HBT Design, Manufacture and Measurement …..
CSDLAB
Department of Materials Science and Engineering,
National Chiao Tung University,
1001 Ta Hsueh Rd., Hsin-chu 300, Taiwan, R.O.C.
TEL: 886-3-5712121 ext. 55319
FAX: 886-3-5745497
E-mail: edc@mail.nctu.edu.tw
Article edited by Zoran Pavlovski
