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Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike

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Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens

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AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem

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AI buildout lifts demand for China high-speed optical module makers

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SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips

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SiS has no plans to withdraw from entry-level chipset market: CEO

Emma Wang, Taipei

Jun 2, 2004, 14:42 0

Daniel Chen, president and CEO of Silicon Integrated Systems (SiS), yesterday denied a market report that SiS is withdrawing from the entry-level chipset market...

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World Diamond Technology accelerates mass production of 300 mm diamond wafers

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