D-Link and GemTek Technology recently landed 802.11g module orders from Intel for use in next-generation Centrino notebooks, according to sources.
The two companies will use Intel’s 802.11g chip solution, with volume shipments slated for the first quarter of next year, the sources said. However, D-Link, which spun off its OEM/ODM manufacturing unit in the third quarter to focus on own-brand business, is likely to outsource production to Global Sun Technology or its subsidiary Alpha Technology.
D-Link, GemTek and Global Sun declined to comment, only saying they will continue to pursue Intel’s orders.
Intel debuted Centrino notebooks last March. The Centrino platform includes a Pentium M processor, an 855PM (Odem) or 855GM (Montara) chipset and an 802.11b wireless network connection module, using a MAC/baseband integrated single chip from Texas Instruments (TI) and a RF transceiver from Royal Philips Electronics. In October, the chip giant began shipping 802.11a/b WLAN modules for Centrino notebooks and continued using network chip solutions from TI and Philips.
It is only natural that Intel, a chip giant, moves on to use own-developed chips, the sources said.
Intel plans to launch 802.11a/g Centrino notebooks, using in-house 802.11a/g chips, in the second half of next year.
Article translated by Chinmei Sung and edited by Chinmei Sung
